... Printed circuits Thin films Composite materials Dielectric properties There has been increasing interest in the development of printable electronic circuits on flexible substrates to meet the growing demand for low‐cost, large‐area, flexible, and lightweight devices, such as roll‐up displays, e...

... and treated from the component reuse point of view for functioning components or from the materials resourcing point of view for non‐functional components. © Emerald Group Publishing Limited 2010 Recycling Waste Printed circuits Composite materials The production of electrical...

... simulation. Conceptually, this study is aimed to provide an efficient damage modelling techniques for laminate composites and flexible modelling methodology for further development of new composite material systems. Research limitations/implications Damaging testing and simulation is not involved...

.... With the proposed modeling, the static and shock responses of optimized PCBs can be analyzed with less computation. The bi‐phase model (PAM System International SA, France, 2000) is a model of heterogeneous materials adapted to unidirectional composite materials reinforced by continuous fibers. This model...

.... It is also apparent that the temperature differences associated with the use of different heat spreader materials are greater for high power pulses than for low power pulses, and the variation is linear which is consistent with linear thermal properties. © MCB UP Limited 2003 Composite materials...