... layer and the bottom metallic copper ground plane placed on a substrate. The conductivity of the copper metal is s = 5.8 × 10⁷ s/m. As the transmission of the MMA structure is zero, the substrate materials can be selected randomly. Totally four combinations of terahertz MMA are designed...

...Zhihua Tao; Guanting Liu; Yuanxun Li; Hua Su Purpose The adsorption and acceleration behavior of 3-mercaptopropyl sulfonate (MPS) were investigated by electrochemical tests for microvia filling by copper electroplating. Design/methodology/approach The synergistic effects of one suppressor...

...Thomas D.A. Jones; David Flynn; Marc P.Y. Desmulliez; Dennis Price; Matthew Beadel; Nadia Strusevich; Mayur Patel; Chris Bailey; Suzanne Costello Purpose This study aims to understand the influence of megasonic (MS)-assisted agitation on printed circuit boards (PCBs) electroplated using copper (Cu...

.../methodology/approach This paper uses the finite element method to simulate flexible electronics with a copper conductor attached to polyimide substrate under tension, by using different parameters of the conductor. Findings By careful variation of copper conductor parameters, the authors obtain...

... detailed observation of the growth morphology of electroless NiP deposited on copper was required. In this study, to elucidate the reaction mechanism of NiP deposits on conductive, but non-catalytic, Cu films on the basis of their nucleation and growth without a Pd catalyst, the deposit morphology...

...K. Fellner; P.F. Fuchs; G. Pinter; T. Antretter; T. Krivec Purpose – The overall aim of this research work was the improvement of the failure behavior of printed circuit boards (PCBs). In order to describe the mechanical behavior of PCBs under cyclic thermal loads, thin copper layers were...

... of ultra high speed digital bus architectures, PCB fabricators will appreciate the need to add an understanding of the drivers of insertion loss (base material loss tangent data, foil roughness and copper cross sectional areas) to their existing experience of architectures with minimal losses...

...Martin Goosey; Rod Kellner Purpose The purpose of this paper is to investigate the potential for using chitin and chitosan sustainable materials to absorb copper from PCB manufacturing effluent and to report the results of an initial feasibility study aimed at demonstrating proof of concept...

...George Milad Purpose The purpose of this paper is to present new developments in electrolytic tin plating designed to eliminate the formation of whiskers over time, when tin is plated on copper. Design/methodology/approach Two main approaches were undertaken to achieve the desired results...

... are designed to promote water solubility and to give improved corrosion (oxidation) protection of the copper surface. Since SBA materials are sparingly soluble in water on their own, a nominal amount of acid is required to enable the SBA to dissolve in the aqueous medium. The benefits were quickly realized...

... is shown in Figure 3 . The electrified panels slide continuously next to solution ejectors that supply fresh solution at a high agitation and behind them are the titanium baskets with copper slugs that supply cations to the solution and cell. Alternatively, if insoluble anodes are used, copper oxide...

...A.J. Cobley; D.J. Comeskey; L. Paniwnyk; T.J. Mason Purpose The purpose of this paper is to investigate if copper nanoparticles could be utilized for two types of through hole plating in printed circuit boards, namely: as a catalytic material to initiate the electroless copper deposition process...

...Edith Steinhäuser Purpose The purpose of this paper is the investigation of the catalytic activities of selected metals in reductant oxidation. Design/methodology/approach Electrochemical measurements were carried out in order to obtain information about the catalytic activity of copper...

...Edith Steinhäuser; Lutz Stamp; Lutz Brandt Purpose The purpose of this paper is to examine the use of additives in formaldehyde‐free copper‐plating solutions with low reducing agent (RA) concentration to improve the start reaction of electroless copper deposition and to enable a copper‐plating...

.../methodology/approach The paper introduces the importance of inner‐layer copper reliability and how to evaluate it. It reviews and discusses the effects of all factors involved, including laminate material, panel design, and chemical controls, on interconnect defects (ICDs). Findings The best possible...

... technology based on ferroelectric‐epoxy polymer‐based flake‐free resin coated copper capacitive (RC3) nanocomposites to manufacture multilayer embedded capacitors. Design/methodology/approach This paper discusses thin film technology based on RC3 nanocomposites. In particular, recent developments in high...

...Teija Laine‐Ma; Pekka Ruuskanen; Satu Kortet; Mikko Karttunen Purpose The adhesion between electroless copper and a substrate is one of the most important factors in the reliability of thermoplastic printed circuit boards. The purpose of this paper is to investigate the effects of mechanical...

...Sudipta Roy Purpose The purpose of the paper is to present an update and the latest results from work on a project which could be useful for maskless printed circuit board (PCB) manufacturing. Design/methodology/approach Copper is plated and etched using a novel electrochemical technique...

... was manufactured as a test demonstrator. Findings The characteristics of some main formaldehyde‐based electroless copper baths were compared. The quality of the sidewalls was characterised and the performance of the process was assessed. Originality/value This paper demonstrates a high‐value manufacturing...

...Sony Mathew; Michael Osterman; Michael Pecht; Frank Dunlevey Purpose The purpose of this paper is to present the results from work on a project aimed at evaluating six different copper alloy substrates coated with pure tin for tin whisker growth. The influence of intermetallic growth between...