...Brent Roeger Purpose The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent...

... methods were developed including direct laser write, laser ablation and inkjet printing. Polymer formulations were developed to suit the fabrication methods. Computer‐aided design (CAD) tools were developed and waveguide layout design rules were established. The CAD tools were used to lay out a complex...

...Rabindra N. Das; Frank D. Egitto; Voya R. Markovich Purpose Material formulation, structuring and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications...

...X.C. Wang; H.Y. Zheng Purpose The purpose of this paper is to discuss laser cutting of FR4, and BT/Epoxy‐based PCB substrates with 355 nm DPSS UV laser. Design/methodology/approach The effects of various laser conditions such as scanning speed, assisting gas, repetition rate and interval...

... coated as a thin film layer deposited on top of the target substrate (Imai et al., 2006 ; Kim et al., 2008). The heat generated by the laser decomposes the precursor which then generates and anneals the small metal particles. The metal aggregates, thus formed are further embossed onto...

... they compare with each other and with modelled calculations of waveguide components. The fabrication techniques include photolithography, laser ablation, direct laser writing, embossing, extrusion and ink jet printing. Findings A number of design rules for polymer multimode waveguides have been found...

... The approaches that may be taken to create glass substrates and the challenges involved are described. Excimer laser machining was used for the formation of microvias and other features in individual glass sheets. In addition, methods for the electroless copper metallisation of the smooth glass surfaces were...

...Uwe Altmann Purpose To give an overview of the main needs of PCB manufacturers and to show how these needs can be met using laser direct imaging (LDI) technology. Design/methodology/approach This paper has been written to provide a review of current needs of PCB manufacturers in different...

...Alex Alaluf; David Birnbaum Examines the use of laser‐induced fluorescence for the inspection of printed circuit boards. Discusses how it works, how it compares with other inspection options and what advantages it offers, particularly for the inspection of low‐contrast materials. Concludes...

... ESI introduces new dual head laser microvia drilling platform enabling improved performance and accuracy Keywords: Microvias, Lasers Electro Scientific Industries, Inc. introduced its dual head microvia drilling platform targeted at the high density interconnect (HDI) and packaging...

... © MCB UP Limited 2000 --> NanoVia Microvias Lasers Venture funded company to focus on microvias Keywords: NanoVia, Microvias, Lasers NanoVia, LP is a company formed specifically to exploit an inventive optical method of creating laser microvias at high speed...

... © MCB UP Limited 2000 --> Excellon Automation Lasers Vias Excellon Automation introduces new laser via formation system Keywords: Excellon Automation, Lasers, Vias Excellon Automation is presenting the world's first laser via formation system with one autoloader...

... © MCB UP Limited 2000 --> NanoVia Microvias Lasers Drilling Adaptive High Speed Microvia Drilling System Keywords: NanoVia, Microvias, Lasers, Drilling NanoVia, LP a company specializing in the manufacture of purpose built high speed microvia drilling systems...

... and semiconductor packaging and finishing industries. © MCB UP Limited 2000 --> Shipley Ronal Lasers Direct imaging Photoresists Keywords Shipley Ronal, Lasers, Direct imaging, Photoresists Shipley Ronal is launching the first in a series of photoresists for use with laser direct...

...M. Owen; E. Roelants; J. Van Puymbroeck In the last two years, laser drilled microvias have become the dominant method for producing blind vias smaller than 150 mm, with over 100 laser drilling machines with a variety of laser types installed worldwide. Only a few of these systems have been...

... Aramid reinforced laminates using laser ablation technology. Laser equipment capable of producing over 100 blind micro‐via holes per second is discussed. The process steps of hole cleaning and plating are reviewed, showing how existing PWB manufacturing technologies can be used. This process is compared...

...H.‐K. Roth; K. Eidner; H. Roth The paper is a report on a newly developed material and on technological studies which open up new methods for the combined application of laser and computer technology for advanced industrial applications, e.g., for the laser direct imaging of conducting paths...