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Keywords: Lasers
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Journal Articles
Circuit World (2011) 37 (4): 20–29.
Published: 22 November 2011
...Brent Roeger Purpose The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent...
Journal Articles
Journal Articles
Journal Articles
Circuit World (2009) 35 (4): 46–55.
Published: 20 November 2009
...X.C. Wang; H.Y. Zheng Purpose The purpose of this paper is to discuss laser cutting of FR4, and BT/Epoxy‐based PCB substrates with 355 nm DPSS UV laser. Design/methodology/approach The effects of various laser conditions such as scanning speed, assisting gas, repetition rate and interval...
Journal Articles
Circuit World (2009) 35 (2): 3–17.
Published: 15 May 2009
... technique that is mass manufacturable, low cost and suitable for use on 3D surfaces. Criteria required for the development of a direct‐writing process have been described. The issues surrounding electroless plating on polyimide have been explained. 2.2.1 Surface activation by laser damage...
Journal Articles
Journal Articles
Circuit World (2007) 33 (1): 22–30.
Published: 13 February 2007
... The approaches that may be taken to create glass substrates and the challenges involved are described. Excimer laser machining was used for the formation of microvias and other features in individual glass sheets. In addition, methods for the electroless copper metallisation of the smooth glass surfaces were...
Journal Articles
Journal Articles
Circuit World (2002) 28 (1): 21–28.
Published: 01 March 2002
...Alex Alaluf; David Birnbaum Examines the use of laser‐induced fluorescence for the inspection of printed circuit boards. Discusses how it works, how it compares with other inspection options and what advantages it offers, particularly for the inspection of low‐contrast materials. Concludes...
Journal Articles
Circuit World (2001) 27 (4)
Published: 01 December 2001
... © MCB UP Limited 2001 --> Microvias Lasers ESI introduces new dual head laser microvia drilling platform enabling improved performance and accuracy Keywords: Microvias, Lasers Electro Scientific Industries, Inc. introduced its dual head microvia drilling platform...
Journal Articles
Circuit World (2000) 26 (3)
Published: 01 September 2000
... © MCB UP Limited 2000 --> NanoVia Microvias Lasers Drilling Adaptive High Speed Microvia Drilling System Keywords: NanoVia, Microvias, Lasers, Drilling NanoVia, LP a company specializing in the manufacture of purpose built high speed microvia drilling systems...
Journal Articles
Circuit World (2000) 26 (3)
Published: 01 September 2000
... Keywords: NanoVia, Microvias, Lasers NanoVia, LP is a company formed specifically to exploit an inventive optical method of creating laser microvias at high speed. The company is funded by a select group of Redmond, Washington investors and is headed by CEO, S. Collar Waters a venture...
Journal Articles
Circuit World (2000) 26 (3)
Published: 01 September 2000
... © MCB UP Limited 2000 --> Excellon Automation Lasers Vias Excellon Automation introduces new laser via formation system Keywords: Excellon Automation, Lasers, Vias Excellon Automation is presenting the world's first laser via formation system with one autoloader...
Journal Articles
Circuit World (2000) 26 (2)
Published: 01 June 2000
... Shipley Ronal Lasers Direct imaging Photoresists Keywords Shipley Ronal, Lasers, Direct imaging, Photoresists Shipley Ronal is launching the first in a series of photoresists for use with laser direct imaging (LDI) techniques. ultraDIRECT is an acid-etch dry film resist which...
Journal Articles
Circuit World (1998) 24 (1): 45–49.
Published: 01 January 1998
...M. Owen; E. Roelants; J. Van Puymbroeck In the last two years, laser drilled microvias have become the dominant method for producing blind vias smaller than 150 mm, with over 100 laser drilling machines with a variety of laser types installed worldwide. Only a few of these systems have been...
Journal Articles
Circuit World (1996) 22 (3): 16–22.
Published: 01 December 1996
... Aramid reinforced laminates using laser ablation technology. Laser equipment capable of producing over 100 blind micro‐via holes per second is discussed. The process steps of hole cleaning and plating are reviewed, showing how existing PWB manufacturing technologies can be used. This process is compared...
Journal Articles
Circuit World (1996) 22 (2): 31–32.
Published: 01 August 1996
...H.‐K. Roth; K. Eidner; H. Roth The paper is a report on a newly developed material and on technological studies which open up new methods for the combined application of laser and computer technology for advanced industrial applications, e.g., for the laser direct imaging of conducting paths...

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