... in an enriched finite element local simulation model to predict the crack initiation and crack propagation. Using the determined location of the initial crack, the energy release rate at the crack tip was calculated, allowing an evaluation of the local loading situation. Findings A good concurrence between...

...K.H. Low; Yuqi Wang Purpose To present a method to model woven fibre reinforced metal matrix composite for multilayer circuit boards. Design/methodology/approach This paper presents a hybrid modelling method to model multilayer multimaterial composites with the combination of metallic...

...K.H. Low; Yuqi Wang Purpose The paper aims to present a modeling method for multi‐layer, multi‐material printed circuit boards (PCBs) in both micro‐structure and board levels. Design/methodology/approach The method incorporates a multilayer finite element model that is established in two parts...

...‐volume, low‐cost products. Computer models are now being used early within the product design stage to ensure that optimal process conditions are used. These models capture the governing physics taking place during the assembly process and they can also predict relevant defects that may occur. Describes...