Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-3 of 3
Keywords: Plastic ball grid array
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Design, analysis and measurement of the cost‐effective substrate of a plastic ball grid array package ‐ NuBGA
Available to Purchase
Journal:
Circuit World
Circuit World (1999) 25 (2): 41–48.
Published: 01 June 1999
...John H. Lau; Tony Chen; Tai‐Yu Chou A family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special designs, these packages consist of a single core of organic material and two‐metal layers...
Journal Articles
Design for Plastic Ball Grid Array Solder Joint Reliability
Available to Purchase
Journal:
Circuit World
Circuit World (1997) 23 (2): 11–13.
Published: 01 June 1997
...S.‐W.R. Lee; J.H. Lau Computational stress analysis was performed in this study to investigate the solder joint reliability of plastic ball grid array (PBGA) packages with various configurations. The packages under investigation were 27 mm body‐size, 1.27 mm ball‐pitch, perimeter PBGAs...
Journal Articles
Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,and Vibration Conditions
Available to Purchase
Journal:
Circuit World
Circuit World (1996) 22 (1): 27–32.
Published: 01 April 1996
...J. Lau; K. Gratalo; E. Schneider; T. Marcotte; T. Baker The mechanical and vibration responses of 225‐pin, 324‐pin and 396‐pin PBGA(plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses...
