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1-3 of 3
Keywords: Solder joint
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Journal Articles
Journal:
Circuit World
Circuit World (1999) 25 (1): 6–24.
Published: 01 March 1999
...Paul T. Vianco An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot‐dipped, plated, and plated‐and‐fused 100Sn and Sn‐Pb...
Journal Articles
Journal:
Circuit World
Circuit World (1997) 23 (2): 11–13.
Published: 01 June 1997
...S.‐W.R. Lee; J.H. Lau Computational stress analysis was performed in this study to investigate the solder joint reliability of plastic ball grid array (PBGA) packages with various configurations. The packages under investigation were 27 mm body‐size, 1.27 mm ball‐pitch, perimeter PBGAs...
Journal Articles
Journal:
Circuit World
Circuit World (1996) 22 (1): 27–32.
Published: 01 April 1996
...J. Lau; K. Gratalo; E. Schneider; T. Marcotte; T. Baker The mechanical and vibration responses of 225‐pin, 324‐pin and 396‐pin PBGA(plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses...
