... ASPIS project that is undertaking a multi‐faceted approach to develop novel and improved nickel‐gold (ENIG) solderable finish chemistries and processes in order to overcome issues such as “black pad” that are known to cause reliability issues. Design/methodology/approach The ASPIS project has four...

...Sabine Schröder This paper describes the properties of a new generation of immersion tin as a solderable surface finish for printed circuit boards. The new process combines the unique technology of Organic Metals with the well introduced technology of immersion tin. A comparison with other...

...Bernhard Wessling As an alternative to hot air levelling, a fundamentally new surface finish chemistry and process for solderability preservation of printed circuit boards is described: a pretreatment of the copper followed by an optimized formulation of an immersion tin. The precise...

...Michael Frederickson Organic and immersion metallic coatings are being used as a replacement for the hot air solder level (HASL) process. Use of these coatings provides advantages for both the fabricator and assembler. Advantages to assemblers include flatter pads (0.25‐0.5 micron thickness...