...Wanjun Yin; Lin-na Jiang Purpose The purpose of this paper through the redundant monitoring unit reflecting the real-time temperature change of the array, an adaptive refresh circuit based on temperature is designed. Design/methodology/approach This paper proposed a circuit design...

...Andrew J. Cobley; Veronica Saez Purpose Electroless plating is an important process in printed circuit board and electronics manufacturing but typically requires temperatures of 70‐95°C to give a suitable deposition rate. This is becoming problematic in industry due to the rising price of energy...

...Lei Nie; Michael H. Azarian; Mohammadreza Keimasi; Michael Pecht Purpose This paper seeks to present a prognostics approach using the Mahalanobis distance (MD) method to predict the reliability of multilayer ceramic capacitors (MLCCs) in temperature‐humidity‐bias (THB) conditions. Design...

...M. Dube; T.J. Dishongh; K.E. Beatty; M. Pecht Temperature measurements using thermocouples are made at several locations on J‐leaded plastic quad‐flat packs and printed wiring boards during the reflow soldering process. Both moisture saturated and dry packages are studied, with little difference...