...Lee‐Ing Tong During the complicated production process in integrated circuit (IC) fabrication, various types of defects on a wafer surface are unavoidable. As the wafer size increases, the clustering phenomenon of the defects becomes increasingly apparent. To upgrade IC products’ yield...

...K. Kumar Data for reliability prediction of integrated circuits is obtained either from well designed accelerated life tests or from MIL‐HDBK‐217E. Although a number of researchers have questioned the validity of prediction based on the data derived from this standard, it continues to remain...

...Richard C. Whitfield; Kam‐Ming Kwok Reports a case study in using a team approach to improve the quality, cycle time and yield of integrated circuits assembled in Hong Kong. Ford’s eight‐disciplines (8‐D) process is the methodology used, and significant improvements are acheived with it. Within...