Skip to Main Content
Article navigation
Volume 13, Issue 1
1 April 1996
Microelectronics International Cover Image for Volume 13, Issue 1
Research Article| April 01 1996

Are BGAs a Concern in SMT? A User’s Point of View Available to Purchase

X. Saint‐Martin;
X. Saint‐Martin
Bull,Les Clayes Sous Bois, France
Search for other works by this author on:
This Site
PubMed
Google Scholar
Y. Stricot;
Y. Stricot
Search for other works by this author on:
This Site
PubMed
Google Scholar
M. Auray;
M. Auray
Bull Electronics Europe,Angers, France
Search for other works by this author on:
This Site
PubMed
Google Scholar
C. Floury
C. Floury
Bull Electronics Europe, Angers, France
Search for other works by this author on:
This Site
PubMed
Google Scholar
Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-812X
Print ISSN: 1356-5362
© MCB UP Limited
1996
Microelectronics International (1996) 13 (1): 22–25.
https://doi.org/10.1108/13565369610800142

BGAs are a new type of surface mountable component. Successful industrial implementation of BGA assembly on electronic boards needs specific studies, evaluations and qualification. The methodology used in Bull is presented,along with an analysis of the different BGA types. Implementation and qualification results are provided.

Keywords:
Ball grid array, Components, Surface mount Technology, Microelectronics
© MCB UP Limited
1996
You do not currently have access to this content.
Don't already have an account? Register

Purchased this content as a guest? Enter your email address to restore access.

Please enter valid email address.
Email address must be 94 characters or fewer.
Pay-Per-View Access
$41.00
Rental
This article is also available for rental through DeepDyve. Read this now at DeepDyve
42 Views
2 Crossref
View Metrics
Optimization of pressure drop and power consumption in microchannels based on fin structure design
A study on surface tension prediction of Sn-based lead-free solder via machine learning algorithms
Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability
Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1

Suggested Reading

The past, present and future of EEE components for space application: COTS ‐ the next generation
Microelectronics International (December,1998)
CSP compatibility in the SMT assembly process
Soldering & Surface Mount Technology (August,1999)
Fatigue Properties of BGA Solder Joints: A Comparison of Thermal and Power Cycle Tests
Microelectronics International (December,1997)
PAD design reliability for SMD passives
Microelectronics International (April,2000)
Fine‐line Passive Components for Hybrid Microelectronics
Microelectronics International (December,1996)

Related Chapters

The Main Components of Well-balanced Information Economy
Models of Modern Information Economy: Conceptual Contradictions and Practical Examples
Management and Business Plan
The Emerald Handbook of Entrepreneurship in Tourism, Travel and Hospitality: Skills for Successful Ventures
Analyzing Context in the Leadership Process
Understanding Context in Leadership

Recommended for you

These recommendations are informed by your reading behaviors and indicated interests.

Cited By

Google Scholar
CrossRef (2)
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal