Literature abstracts

ZAKEL, E., SIMON, J. and SCHULER, S., Verbindungstechnik in der Elektronik, Vol. 2, No. 2, pp. 53–57, June (1990) TAB is an attractive microconnecting technology for chips with a high number of I/Os. The principles of TAB technology and some new developments are presented. These are concerned with the problems of reducing pressure during gang bonding and the absence of the possibility of bumping single chips. The solutions presented are bonding with a liquid gold‐tin cushion for stress compensation and the application of selective electroless plating solutions for the bumping process. The possibilities of making TAB technology available for small and medium‐size companies are pointed out.