IMAPS-CPMT 2014 Poland
Article Type: Guest editorial From: Microelectronics International, Volume 32, Issue 3
The International Microelectronics and Packaging Society (IMAPS) – Poland Chapter was established in September 1982. In the beginning, it was the ISHM – Poland Chapter, and from 1997, it became the IMAPS – Poland Chapter.
The IMAPS is a non-profit-making organization whose aim is to spread knowledge related to hybrid microelectronics – a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization.
The 38th IMAPS-CPMT Poland International Conference was held in Rzeszów-Czarna at the hotel Perła Bieszczadów and took place between 21 and 24 September 2014. This event was organized by the Rzeszów University of Technology. The scope of the conference covered everything in electronics between the chip and the system. The conference was attended by 85 participants, including 19 guests from abroad. During the conference, 14 invited lectures and 71 posters were presented. The conference was supported by one domestic and five international journals indexed by Thomson Reuters.
In this special issue of Microelectronics International, ten papers have been collected, covering the processes and procedures associated with the manufacture of electronic materials and device design. All of them were subjected to the journal’s regular reviewing procedure.
The first paper (by Guzdek and Wzorek) describes the investigations of the new magnetoelectric composites based on TbFe2. Compared to other composites described in the literature, the presented composites possess relatively high magnetoelectric effect and may be applied in sensors, actuators and ultrasonic transducers.
The results of investigations in the second paper (by Markowski et al.) show that the germanium layers doped with vanadium and gold can be used to fabricate the thermoelectric generators on LTCC substrates.
The next three papers also describe the different aspects of LTTC technology, including sensors and microreactors manufacturing (Pietrikova et al.; Malecha et al. and Belavič et al.).
The seventh article (Dziurdzia el al.) discusses embossing as an alternative and effective method for patterning of fuel microchannels in SOFCs.
Myśliwiec et al. then reported the material and technological aspects of high-temperature sic device packages’ reliability.
The work of Drabczyk et al. confirms the potential of the application of ITO as ARC layer and, according to their low resistivity, as possible use as a functional counter electrode in photovoltaic structures.
Górecki and Ptak, in the ninth article, propose the electrothermal model of the LED module, taking into account electrical, optical and thermal properties of the diodes contained in the module.
The final article (by Kocanda and Kos) describes the new economical technology for low-static energy consumption.
I would like to thank all the authors for their scientific work and contributions that have led to the development and publication of this special issue of Microelectronics International. I hope that it will be of interest to readers of the journal and that it will help them find novel solutions, contribute to the creation of new ideas and initiate many varied discussions about the technologies in microelectronics. I believe that this branch of science could be effectively developed in the future.
Agata Skwarek - Guest Editor
