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Purpose

While wide-bandgap (WBG) systems have been increasingly adopted in high-frequency, high-power, and high-temperature applications, efficient electrostatic management in compact devices continues to pose a challenge. There are few systematic investigations of compact electrostatic shielding in WBG platforms, despite research on material characteristics, device packaging, and two-dimensional material integration. Accordingly, this review aims to systematically evaluate recent advances in compact electrostatic shielding devices for WBG systems, with a particular focus on materials, fabrication strategies, and programmable microcontroller-based control approaches for real-time shielding optimization.

Design/methodology/approach

This review systematically synthesizes recent advances by integrating three key perspectives: (i) state-of-the-art shielding materials, (ii) fabrication strategies, and (iii) programmable microcontroller-based adaptive control frameworks for electrostatic field optimization. The methodology is based on a comparative literature analysis of electrostatic shielding mechanisms across heterogeneous systems, focusing on charge regulation and field redistribution under high-frequency, high-density conditions while enabling comparison of microcontroller-based enabling technologies and shielding strategies through their functional roles and performance metrics.

Findings

Key findings indicate that microcontroller-driven feedback, in conjunction with nanocomposites, MXenes, and multilayer coatings, can significantly enhance electrostatic protection while reducing footprint and cost. Compact electrostatic shielding approaches achieve moderate to high efficiency (0.49 s decay to 99.9% collection) with low-to-moderate footprint, weight, and dynamic adaptability, underscoring trade-offs in high-speed WBG systems. Additionally, integration challenges such as spatial restrictions, switching oscillations, and charge accumulation are addressed.

Originality/value

This review provides a strategic roadmap for more dependable next-generation WBG power electronics by combining advanced materials with adaptive control strategies to enable durable, compact, and adaptable electrostatic shielding solutions.

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