IMAPS Europe

IMAPS Europe

Keywords: IMAPS, Conferences

13th European Microelectronics and Packaging Conference

The 13th European Microelectronics and Packaging Conference and Exhibition will be held at the Palais de la Musique et des Congrès de Strasbourg– France, 30, 31 May and 1 June 2001, Strasbourg, France.

This year it will be organized by IMAPS France jointly with the Benelux and German societies.

General chair: Yves Le Goff Thomson-CSF Detexis.

Technical Programme chair: Jean Claude Rames, Matra BAe Dynamics.

Topic areas:

• Automotive electronic.

• Chip scale package.

• Design, modelling, simulation.

• Environmentally compatible electronics.

• Flip chip.

• High density packaging.

• Integrated passives.

• Laser processing.

• Low cost production.

• Management and marketing.

• Manufacturing technologies.

• Materials.

• Medical electronics.

• MEMS packaging.

• Microwave packaging.

• Mobile electronics.

• Optoelectronics.

• Power packaging.

• Printed wiring boards.

• Quality, reliability.

• Soldering/welding/brazing.

• Surface mount technology.

• Thermal management.

• Wireless packaging.

Microelectronics International will publish the full conference programme in our May 2001 issue of the journal.