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Appointments

Datacon Semiconductor Equipment GmbH appoints new head of product management

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Gerry Waldron appointed Applications Engineering Manager at MRSI Group

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Ferro Electronic Materials names Hodder North American Sales Manager, East Region

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Brewin joins The National Physical Laboratory

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Book review

An Engineer's Handbook of Encapsulation and Underfill Technology

Professor Nihal Sinnadurai
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Effects of aspect ratio on the temperature coefficient of resistance matching and low frequency noise levels in thick film strain sensors

J.K. Atkinson; R.P. Sion; Z. Zhang
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Thick film microstrip rejection filter with improved Q using overlay

Sunit Rane; Vijaya Puri
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Substrate characterization: simulation and measurement at high microwave frequencies

Charles Free; Zhengrong Tian; Peter Barnwell
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Computational and experimental approach to thermal management in microelectronics and packaging

Cosme Furlong; Ryszard J. Pryputniewicz
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New approach for calculation of line parameters of IC interconnects

Hasan Ymeri; Bart Nauwelaers; Karen Maex; David De Roest
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Development of a reliable packaging process for flip chip on ceramics

Zhaowei Zhong
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Some results obtained with diffusion patterning technology

Darko Belavic; Marko Hrovat; Marko Pavlin; Janez Holc
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Conferences

InterPACK '01®

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Call for papers

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Advanced packaging technologies in the electronics industry

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Editorial

Mind the gap

John Atkinson
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IMAPS news

IMAPS USA

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IMAPS Europe

Professor Nihal Sinnadurai
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IMAPS – Diary of events

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IMAPS UK

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IMAPS Poland

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IMAPS USA. Flip Chip Technology workshop planned by IMAPS

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Industry news

IMEC announces MEMS design and technology agreement with INTI-CITEI, Argentina

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Philips and LG join forces in display components activities

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SMT/ES+S/HYBRID exhibition changes name

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MRSI opens new facility, major growth expansion

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MRSI 505 opens eutectic die attach lab facility

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US$160 million investment in joint venture wafer lab in Germany

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New £7.5 million optoelectronics foundry and research centre spearheads Scotland's drive in global communications market

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Loctite acquires Power Devices Inc.

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MCE launches solution to ASIC and IC obsolescence

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Semi Dice selected as exclusive US distributor of international rectifier commercial die and wafer products

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Middlesex/Tec-Sem alliance

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Multimillion-euro orders from Asia and the USA lead to massive sales surge at Datacon

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Thomson-CSF Laser Diodes and Alcatel Optronics Division announce partnership for manufacturing materials for high power lasers

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Amkor adds latest packaging equipment to advanced prototype development lab

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Amkor/Anam and Texas Instruments extend cooperation on deep submicron process technology for advanced semiconductor manufacturing

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Ferro Electronic Materials initiates major expansion in New York

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Free flip chip information

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International diary

International diary

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Internet commentary

... we have the kind of advertising we deserve[1]

Brian Ellis
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New products

New cost-effective LTCC materials from Ferro

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Bonder attachment for reworking underfilled flip chips

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Microstamping and pump dispensing combined for ultra fine conductive epoxy dots

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Amkor is expanding LGA package offerings

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Impressive palladium reductions in new RE 88-Series surge resistor materials

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Ferro Electronic Materials launches new RE 88 series of "thrifted" thick film surge resistor materials

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A6 S Microwave LTCC materials system for high frequency low cost applications

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MCE launches low risk, low customised chips for measurement and sensing

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Technology news from Philips Semiconductors

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LCD assembly gains through-put increase with Micro Join 4200 Series Bonders

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Loctite introduces dam and fill products for encapsulation applications

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Microscope ergonomics

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Precision thin film resistors now available in chip scale format

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New Load Port is the first in the industry to meet new SEMI automation standard

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New state-of-the-art chip scale package EMI I RFI filter arrays

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Philips Semiconductors has new angle on automotive sensing

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Next-generation Laser Probe System for flip chips

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Publications

The power of amplifier design

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Reports

Hybrid circuit and MCM suppliers fight for a share of a e1.1 billion European market

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One billion cellular handset market by 2004

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TechSearch International analyzes market surge in high density interconnect flex circuits

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High penetration and advancing technology in wireless industry necessitate outsourcing

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Market analysis and technology trends

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Seminars and training courses

EuroSimE 2001 – 2nd International Conference

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Advanced Technology Workshop on Ceramic Technologies for Microwave

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