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Volume 18, Issue 1
1 April 2001
Microelectronics International Cover Image for Volume 18, Issue 1
Article Contents
Non Article| April 01 2001

Call for papers Free

Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-812X
Print ISSN: 1356-5362
© MCB UP Limited
2001
Microelectronics International (2001) 18 (1)
https://doi.org/10.1108/mi.2001.21818aac.003

Call for papers

2001 International Conference on Electronics Packaging (ICEP) and 15th Microelectronics Show (formerly the IEMT/IMC Symposium)

18-20 April 2001Tokyo Ryutsu Center, Tokyo, Japan

General Chair – Noboru Ichinose, Waseda University.Vice General Chair - Shinichi Nishi, Konica.

Contact for Registration, Technical Program, and Exhibition Secretariat 2001 ICEPJIEP, 3-12-2 NishiogikitaSuginamu-ku, Tokyo 167-0042, JapanTel: +81-3-5310-2010Fax: +81-3-5310-2011E-mail: mailto;imaps-j@jiep.or.jpInternet: http://www.jiep.or.jp/index.html

Sponsored by IMAPS Japan, JIEP, IEEE/CPMT Japan Chapter.

© MCB UP Limited
2001
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A study on surface tension prediction of Sn-based lead-free solder via machine learning algorithms
Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability
Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1
Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguide

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