Development of a reliable packaging process for flip chip on ceramics

A reliable packaging process for flip chip on ceramic substrate using gold bumps and adhesive was successfully developed. The bonding parameters and flip chip assemblies using four adhesive materials were investigated by means of design of experiments and yield runs. The packaging yield was 100 per cent. All the packages assembled during the yield runs passed various reliability tests. The packages attained 100 per cent reliability required for an industrial application.