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A new method for analysis of IC interconnects propagation parameters is suggested. A potential integral formalism is employed that enables us to express general solutions for the scalar potential in each layer of a multilayer model. These expressions for potential led to the derivation of an equation for calculating the line parameters of interconnect lines in such a multilayer configuration. This approach is verified by two‐dimensional examples of the integrated circuit interconnects with errors within 0.5 per cent to 1 per cent.

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