IMAPS Brazil. IMAPS issues call for papers for IMAPS Brazil 2001
IMAPS Brazil
IMAPS issues call for papers for IMAPS Brazil 2001
IMAPS Brazil has issued a call for papers for participation in the IMAPS Brazil Technical Symposium 2001. IMAPS Brazil 2001, the 2001 International Technical Symposium on Electronic Packaging and Assembling, will be held from 1-3 August 2001, at the Maksoud Plaza Hotel, São Paulo, Brazil. The symposium is sponsored by IMAPS Brazil and IMAPS.
Technical topics for paper submission may include Ball grid arrays; Chip scale packaging; Flip chip technology; Fine pitch soldering; Chip-on-board;Design process and characterization technology; Lead-free developments;Conductive adhesives and new inorganic materials developments; Quality and reliability; Thick film technology; MEMS; Design for manufacturability; Quality and reliability; Economics and marketing: market and market trends; and technology roadmaps and trends for electronic assembly (personal computer,wireless and telecommunication products).
Authors should submit papers, in English, by 25 May 2001.
Further details: Marcio Biasoli, Electronic Packaging Laboratory, National Institute of Technological Information. E-mail: Biasoli@im.cti.br; Tel: +55 19 3746-6062;Fax: +55 19 3289-7875; Internet: http://www.imaps.org
