Kulicke & Soffa and Amkor Technology announce Letter Of Intent for 200 wire bonders

Kulicke & Soffa and Amkor Technology announce Letter Of Intent for 200 wire bonders

Keywords: Amkor Technology, Wire bonding

Kulicke & Soffa Industries Inc. and Amkor Technology announced that Amkor has issued a Letter of Intent (LOI) indicating its intention to purchase 200 K&S Maxmim ball bonders to help support its ramp to ultra fine pitch wire bond technology. The first shipments are scheduled for April of this year.

This is the first major initiative for the new K&S ball bonder platform,which is designed to enable IC manufacturers to continue driving down pad pitch and increasing wire bonding productivity and yield. Amkor will use the machines to manufacture advanced ultra fine pitch ball grid array (BGA) packages at its Korea, Taiwan, Philippines, Japan, and China assembly facilities.