Issues

Appointments

Bruno Miquel appointed product manager at MRSI

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Book review

Environment-friendly Electronics: Lead-free Technology

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Tools for evaluation of electrical performance of chip‐on‐board devices

A. Cordery; N. Kilbey; N. Suthiwongsunthorn
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Effects of material parameters and processing conditions on high voltage sensitivity of polymer thick film resistors

Y. Srinivasa Rao; M. Satyam
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No flow underfill: additional reliability and failure mode analysis

Michael A. Previti; Peter Ongley
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The effects of aged Cu‐Al intermetallics to electrical resistance in microelectronics packaging

Tan Chee Wei; Abdul Razak Daud
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Thick film symmetrical EMI LC cells

O. Aleksić; V. Desnica; M. Luković; Lj.D. Živanov
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Electrical characterisation of BGA package for RF applications

Arun Chandrasekhar; Eric Beyne; Walter De Raedt; Bart Nauwelaers; Tania Van Bever
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Company profile

Company Profile – IPL, Dorchester, UK

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IMAPS news

IPC issues call for participation for optoelectronics conference

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IMAPS Appoints Steve Capp Treasurer

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IMAPS Nordic

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IMAPS Advanced Technology Workshop on Passive Integration

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IMAPS USA

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Flip Chip 2002 conference and exhibition offers "latest and greatest" in flip chip technology

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IMAPS – Europe Cracow, Poland, 16-18 June 2002

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IMAPS Ceramic Technologies Workshop provides glimpse into the future

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Industry news

Coorstek gets invision tech pac

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Datacon phases out collaboration with Kulicke & Soffa

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Kulicke & Soffa and Amkor Technology announce Letter Of Intent for 200 wire bonders

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International Diary

International Diary

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Internet commentary

Internet commentary

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New products

New bonder offers sub-micron alignment

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KS 75: Post-reflow solder joint inspection with inherently low false calls

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Philips Semiconductors reinvents radio architecture

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Scribe and break 100-3 for delicate wafers

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MRSI announces

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Industry "First" – automatic stamping tool changing

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