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Volume 12, Issue 1
1 January 1995
Microelectronics International Cover Image for Volume 12, Issue 1
Review Article| January 01 1995

Resist Coating of Cylindrical Samples for 3‐D Lithography

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C.G. Giaconia
Dipartimento di Ingegneria Elettrica, Università di Palermo, Palermo, Italy
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G. Grasso
Dipartimento di Ingegneria Elettrica, Università di Palermo, Palermo, Italy
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C. Arnone
Dipartimento di Ingegneria Elettrica, Università di Palermo, Palermo, Italy
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-812X
Print ISSN: 1356-5362
© MCB UP Limited
1995
Microelectronics International (1995) 12 (1): 22–24.
https://doi.org/10.1108/eb044552

A quantitative investigation of a dipping technique for depositing a thin layer of resist on circularly symmetrical objects is presented. The results obtained are valuable for preparing three‐dimensional (3‐D) surfaces suited for spatial microlithographic processes in the 1 to 10 µm linewidth range.

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© MCB UP Limited
1995
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