A New Dice Bonding Method for Hybrid Technology Available to Purchase

The bonding of laser semiconductor dice for optical telecommunication systems is very difficult because of the fragility of these new components, the necessity to bond them with very high accuracy in their location, and the necessity to have a very homogeneous bond with a low thermal resistivity. A new bonding equipment has, therefore, been developed for this application: it can be used for preform, eutectic, or epoxy bonding, and naturally with many other components. Compared with other bonding equipment, such as preform or eutectic scrubbing, it presents the following advantages: the bonding is initiated and homogenised with an ultrasonic vibration of very small energy and amplitude which does not damage the laser dice; the workholder is built with a very small thermal inertia in order to prevent degradation of the bond when indium or tin alloy preforms are used; and it allows very high accuracy in the location of the dice. The results obtained with indium and epoxy bonding show that this equipment is particularly suitable for laser die bonding, and it permits the use of epoxy creams for this application in spite of their relatively low thermal conductivity.