Open figure viewer
Vitramon now offers its complete range of multilayer chips with Nickel Barrier terminations to meet the needs of automatic soldering operations at high temperatures. The company's unique Nickel Barrier process was developed by the central research department in Connecticut. The specially formulated materials used are designed to overcome problems that can occur at soldering due to thermal mismatch.
This content is only available via PDF.
© MCB UP Limited
1986
You do not currently have access to this content.
