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Volume 5, Issue 1
1 January 1988
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Hybrid Circuits
Hybrid Circuits Cover Image for Volume 5, Issue 1
Review Article| January 01 1988

Thermal Analysis of Hybrid Circuits with Mounted Components Available to Purchase

G. De Mey;
G. De Mey
Ghent State University, Ghent, Belgium
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L. Van Schoor
L. Van Schoor
KIHO, Ghent, Belgium
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 2977-7062
Print ISSN: 0265-3028
© MCB UP Limited
1988
Hybrid Circuits (1988) 5 (1): 28–32.
https://doi.org/10.1108/eb044306

In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors and integrated circuits is taken into account.

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© MCB UP Limited
1988
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