Thermal Studies on Hybrid Circuits Available to Purchase

In this paper the temperature distribution in hybrid circuits will be studied in two different ways. First of all the results of numerical simulations obtained with the programs PROMETHEE and HYBRITHERM will be shown. Secondly, experimental temperature plots obtained with infra‐red thermography will be compared with the theoretical results. The influence of the substrate material (epoxy, glass, Al2O3, AlN and BeO) on the temperature distribution will be demonstrated. Various ways of cooling will also be considered. It will be shown that using high quality substrates such as AlN or BeO is not always useful from a thermal point of view.