Article navigation
Volume 5, Issue 1
1 January 1988
This article was originally published in
Hybrid Circuits
Hybrid Circuits Cover Image for Volume 5, Issue 1
Review Article| January 01 1988

A Review of Thin Film Resistors and Their Assembly Problems: Part 2

D. Mills
Hy‐Comp Ltd, Ashford, Middlesex, England
Search for other works by this author on:
This Site
PubMed
Google Scholar
Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 2977-7062
Print ISSN: 0265-3028
© MCB UP Limited
1988
Hybrid Circuits (1988) 5 (1): 40–41.
https://doi.org/10.1108/eb044308

This paper has been presented in two parts. Part 1, after an introduction to thin film resistor technology, gave a review of thin films and other resistors, followed by designer's considerations when using resistors and networks. Part 2 will deal with assembly problems.

This content is only available via PDF.
© MCB UP Limited
1988
You do not currently have access to this content.
Don't already have an account? Register

Purchased this content as a guest? Enter your email address to restore access.

Pay-Per-View Access
$41.00
Rental
This article is also available for rental through DeepDyve. Read this now at DeepDyve
169 Views

New and popular articles

Effect of ultrasonic loading time on the microstructures and performance of Cu/Al joints at solid-liquid mixed state
Experimental investigations of the effect of sintering pressure and temperature on the porosity and mechanical properties of sintered silver
Design and finite element simulation of a novel bimorph cantilever-based piezoelectric micromachined ultrasonic transducer with enhanced acoustic performance
Experimental study for dual-channel-MCM reliability with complex condition

Suggested Reading

A Review of Thin Film Resistors and their Assembly Problems
Hybrid Circuits (February,1987)
Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors
Circuit World (January,2014)
Environmental tests of embedded thin- and thick-film resistors in comparison to chip resistors
Circuit World (January,2014)
Reliability of Soldered Joints: A Description of the State of the Art: Part 3
Soldering & Surface Mount Technology (March,1990)
Thin‐film embedded resistor and capacitor technologies
Circuit World (March,2004)

Related Chapters

Wireless sensor network based pipeline failure detection system using non-intrusive relative pressure and differential temperature measurements
Transforming the Future of Infrastructure through Smarter Information: Proceedings of the International Conference on Smart Infrastructure and ConstructionConstruction, 27–29 June 2016
APPLICATION AND RESEARCH OF THE HOUSING BASE CONCRETE TO THE CURING USING HEATING SHEET
Challenges of Concrete Construction: Volume 6, Concrete for Extreme Conditions: Proceedings of the International Conference held at the University of Dundee, Scotland, UK on 9–11 September 2002
EXPERIMENTS ON CONCRETE UNDER SHOCK LOADING
Challenges of Concrete Construction: Volume 6, Concrete for Extreme Conditions: Proceedings of the International Conference held at the University of Dundee, Scotland, UK on 9–11 September 2002

Recommended for you

These recommendations are informed by your reading behaviors and indicated interests.

Cited By

Google Scholar
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal