Applied Nanotech Holdings, Inc. expands research agreement

Article Type: Industry news From: Microelectronics International, Volume 26, Issue 2

Applied Nanotech Holdings, Inc. have announced that the third phase of its research project with a leading industrial chemical products company in Japan,announced on 29 September 2008, has been expanded and the previously announced funding of $700,000 has been increased to $1.2 million over the next 12 months in order to accelerate the prototyping of copper ink-jettable inks and product introduction. The parties also expect a fourth phase of the project, of at least the same magnitude, to begin in October 2009 to expand the applications.

In addition, the companies agreed to enter negotiations to finalize an exclusive worldwide license to Applied Nanotech’s copper inks technology within the parameters set forth in the current research agreement between the companies. These parameters include an upfront payment of up to $2.0 million and a running royalty rate of 4 per cent on sales of the copper ink product. The parties agreed to finalize and execute the license agreement no later than 15 April 2009. During the period until then, the parties will formulate a comprehensive worldwide license agreement drafted in both English and Japanese, based on the results of the research and development partnership.

For further information, please visit the web site: www.appliednanotech.net