Issues

Appointments

AVG Technologies names Craig Kensek Global Product Reviews Director

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Fine and ultra‐fine pitch wire bonding: challenges and solutions

Z.W. Zhong
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Influence of solution acidity on composition, structure and electrical parameters of Ni‐P alloys

Z. Pruszowski; P. Kowalik; M. Cież; J. Kulawik
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Silicon Schottky barrier photodiodes with a thin AlN nucleation layer

L.S. Chuah; Z. Hassan; H. Abu Hassan; C.W. Chin; S.M. Thahab; S.C. Teoh
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Ruthenium dioxide doped manganite‐based NTC thermistors for low‐resistance applications

Shweta Jagtap; Sunit Rane; Suresh Gosavi; Dinesh Amalnerkar
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Comparison between models for p‐n junctions parameters extraction

G.C. Pesenti; H. Boudinov
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Electrical properties and electrical equivalent models of thick‐film and LTCC microcapacitors

Edward Miś; Andrzej Dziedzic; Karol Nitsch
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Polymer‐metal nano‐composite films for thermal management

Björn Carlberg; Teng Wang; Johan Liu; Dongkai Shangguan
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Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technology

E. Eisermann; K. Höll; W. Smetana; W. Tusler; M. Unger; J. Whitmarsh
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Industry news

DEK delivers solar solutions for the thin-film generation

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Embedded Systems Show 2008 delivers “first-rate business leads”

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Moscow Metro: the world’s first major transport system to operate fully contactless with NXP’s MIFARE technology

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Rutronik receives “Distributor of the Year 2008 Award” from Samsung Electro-Mechanics GmbH

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Fairchild Semiconductor’s European power seminars provide design solutions to enable energy-efficiency

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Orolia acquires Rapco Electronics extending reach of time and frequency sales

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Applied Nanotech Holdings, Inc. expands research agreement

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International diary

International diary

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New products

Elgar XWave AC power source/frequency converter combines high-current capability and modular architecture

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Lantronix unveils enhanced software development kit for its embedded wired and wireless modules

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Cadence unveils next-generation parallel circuit simulator for the verification of complex analogue and mixed-signal integrated circuit designs

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New NXP platform brings viewing experience of the future to mainstream flat TVs now

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Light enhancing, heat dissipating silicones from Intertronics

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LDO regulator offers stable output without requiring a load capacitor

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Aries Electronics’ new 6.5 mm centre probe test socket features versatile design ideal for test and burn-in

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New LFR complements CWT from power electronic measurements

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Microchip technology announces 1.5 A MOSFET drivers in SOT-23 package

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C&K develops micro-miniature pendulum detect switch with top and side actuation

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Fairchild semiconductor’s 300 mA low VIN low-dropout offers higher efficiency in less space for digital applications

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New ITS from Versaperm Ltd

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