Issues

Appointments

Future Horizons signs up Amir Ben-Artzi as Israeli representative

View articletitled, Future Horizons signs up Amir Ben-Artzi as Israeli representative
Add to Citation Manager for Future Horizons signs up Amir Ben-Artzi as Israeli representative

GSA appoints leading European executive to its Europe-Middle East-Africa Council

View articletitled, GSA appoints leading European executive to its Europe-Middle East-Africa Council
Add to Citation Manager for GSA appoints leading European executive to its Europe-Middle East-Africa Council

DEK Solar appoints Andy Ure to spearhead business development in America

View articletitled, DEK Solar appoints Andy Ure to spearhead business development in America
Add to Citation Manager for DEK Solar appoints Andy Ure to spearhead business development in America

Dr Barry Park appointed new Theme Manager at NanoKTN

View articletitled, Dr Barry Park appointed new Theme Manager at NanoKTN
Add to Citation Manager for Dr Barry Park appointed new Theme Manager at NanoKTN

Effects of the polarity of high‐electric field stressing on power VDMOSFETs parameters

R. El Bitar; G. Salloum; B. Nsouli
View articletitled, Effects of the polarity of high‐electric field stressing on power VDMOSFETs parameters
Open the PDF for Effects of the polarity of high‐electric field stressing on power VDMOSFETs parameters in another window
Add to Citation Manager for Effects of the polarity of high‐electric field stressing on power VDMOSFETs parameters

Aluminium‐silicon alloy and its composites reinforces by silicon carbide particles

Montasser S. Tahat
View articletitled, Aluminium‐silicon alloy and its composites reinforces by silicon carbide particles
Open the PDF for Aluminium‐silicon alloy and its composites reinforces by silicon carbide particles in another window
Add to Citation Manager for Aluminium‐silicon alloy and its composites reinforces by silicon carbide particles

The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad

Hui Xu; Changqing Liu; Vadim V. Silberschmidt; Zhong Chen; Jun Wei
View articletitled, The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad
Open the PDF for The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad in another window
Add to Citation Manager for The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad

High photoluminescence of silicon nanostructures synthesized by laser‐induced etching

Asmiet Ramizy; Khalid Omar; Z. Hassan
View articletitled, High photoluminescence of silicon nanostructures synthesized by laser‐induced etching
Open the PDF for High photoluminescence of silicon nanostructures synthesized by laser‐induced etching in another window
Add to Citation Manager for High photoluminescence of silicon nanostructures synthesized by laser‐induced etching

Design and analysis of a novel fine pitch and highly stretchable interconnect

Yung‐Yu Hsu; Mario Gonzalez; Frederick Bossuyt; Fabrice Axisa; Jan Vanfleteren; Bart Vandevelde; Ingrid de Wolf
View articletitled, Design and analysis of a novel fine pitch and highly stretchable interconnect
Open the PDF for Design and analysis of a novel fine pitch and highly stretchable interconnect in another window
Add to Citation Manager for Design and analysis of a novel fine pitch and highly stretchable interconnect

Design of SIPC‐based complementary LC‐QVCO in 0.18‐μm CMOS technology for WiMAX application

Harikrishnan Ramiah; Tun Zainal Azni Zulkifli; Noramalia Sapiee
View articletitled, Design of SIPC‐based complementary LC‐QVCO in 0.18‐<strong><em>μ</em></strong>m CMOS technology for WiMAX application
Open the PDF for Design of SIPC‐based complementary LC‐QVCO in 0.18‐<strong><em>μ</em></strong>m CMOS technology for WiMAX application in another window
Add to Citation Manager for Design of SIPC‐based complementary LC‐QVCO in 0.18‐<strong><em>μ</em></strong>m CMOS technology for WiMAX application

Development of 2.4 and 3.5 GHz 0.15 μm GaAs PHEMT medium‐power amplifier employing core‐based design approach

Amiza Rasmi; Arjuna Marzuki; Mohd Nizam Osman; Ahmad Ismat Abdul Rahim; Mohamed Razman Yahya; Abdul Fatah Awang Mat
View articletitled, Development of 2.4 and 3.5 GHz 0.15 <strong><em>μ</em></strong>m GaAs PHEMT medium‐power amplifier employing core‐based design approach
Open the PDF for Development of 2.4 and 3.5 GHz 0.15 <strong><em>μ</em></strong>m GaAs PHEMT medium‐power amplifier employing core‐based design approach in another window
Add to Citation Manager for Development of 2.4 and 3.5 GHz 0.15 <strong><em>μ</em></strong>m GaAs PHEMT medium‐power amplifier employing core‐based design approach

New CMOS potentiostat as ASIC for several electrochemical microsensors construction

Lukas Fujcik; Roman Prokop; Jan Prasek; Jaromir Hubalek; Radimir Vrba
View articletitled, New CMOS potentiostat as ASIC for several electrochemical microsensors construction
Open the PDF for New CMOS potentiostat as ASIC for several electrochemical microsensors construction in another window
Add to Citation Manager for New CMOS potentiostat as ASIC for several electrochemical microsensors construction

Industry news

New global consortium for developing microelectronics with enhanced reliability

View articletitled, New global consortium for developing microelectronics with enhanced reliability
Add to Citation Manager for New global consortium for developing microelectronics with enhanced reliability

NEC Electronics and Renesas reach a definitive agreement on business integration

View articletitled, NEC Electronics and Renesas reach a definitive agreement on business integration
Add to Citation Manager for NEC Electronics and Renesas reach a definitive agreement on business integration

Worldwide semiconductor industry capital spending will decline by 47.9 percent to $22.9 billion in 2009 – Gartner

View articletitled, Worldwide semiconductor industry capital spending will decline by 47.9 percent to $22.9 billion in 2009 – Gartner
Add to Citation Manager for Worldwide semiconductor industry capital spending will decline by 47.9 percent to $22.9 billion in 2009 – Gartner

LPKF wins biggest order in its company history

View articletitled, LPKF wins biggest order in its company history
Add to Citation Manager for LPKF wins biggest order in its company history

Microsemi technology helps power Belgian bid to win solar challenge

View articletitled, Microsemi technology helps power Belgian bid to win solar challenge
Add to Citation Manager for Microsemi technology helps power Belgian bid to win solar challenge

The NanoKTN supports European Commission's investment in economic wealth of Europe

View articletitled, The NanoKTN supports European Commission's investment in economic wealth of Europe
Add to Citation Manager for The NanoKTN supports European Commission's investment in economic wealth of Europe

TSMC selects Synopsys HSIM Simulator for sub-40 nm memory IP characterisation

View articletitled, TSMC selects Synopsys HSIM Simulator for sub-40 nm memory IP characterisation
Add to Citation Manager for TSMC selects Synopsys HSIM Simulator for sub-40 nm memory IP characterisation

SMART SYSTEMS INTEGRATION 2010 offers the ideal forum for industry and research

View articletitled, SMART SYSTEMS INTEGRATION 2010 offers the ideal forum for industry and research
Add to Citation Manager for SMART SYSTEMS INTEGRATION 2010 offers the ideal forum for industry and research

OBDUCAT AB wins SEK 3 million order from the Russian Academy of Sciences

View articletitled, OBDUCAT AB wins SEK 3 million order from the Russian Academy of Sciences
Add to Citation Manager for OBDUCAT AB wins SEK 3 million order from the Russian Academy of Sciences

“EMPACT” – means working together

View articletitled, “EMPACT” – means working together
Add to Citation Manager for “EMPACT” – means working together

UKTI and NanoKTN Seek “Best UK Nano Company” at UK NanoForum and Emerging Technologies 2009

View articletitled, UKTI and NanoKTN Seek “Best UK Nano Company” at UK NanoForum and Emerging Technologies 2009
Add to Citation Manager for UKTI and NanoKTN Seek “Best UK Nano Company” at UK NanoForum and Emerging Technologies 2009

Fujitsu Microelectronics and TSMC to collaborate on 28 nm process technology

View articletitled, Fujitsu Microelectronics and TSMC to collaborate on 28 nm process technology
Add to Citation Manager for Fujitsu Microelectronics and TSMC to collaborate on 28 nm process technology

International diary

International diary

View articletitled, International diary
Add to Citation Manager for International diary

New products

NXP claims breakthrough in MOSFET performance with world's first sub-1 mΩ MOSFET in a Power S08 package

View articletitled, NXP claims breakthrough in MOSFET performance with world's first sub-1 mΩ MOSFET in a Power S08 package
Add to Citation Manager for NXP claims breakthrough in MOSFET performance with world's first sub-1 mΩ MOSFET in a Power S08 package

Renesas Technology halves SiP design time with “SiP Top-Down Design Environment”

View articletitled, Renesas Technology halves SiP design time with “SiP Top-Down Design Environment”
Add to Citation Manager for Renesas Technology halves SiP design time with “SiP Top-Down Design Environment”

Molex introduces the Mini-Fit H2O mid-range power connector

View articletitled, Molex introduces the Mini-Fit H2O mid-range power connector
Add to Citation Manager for Molex introduces the Mini-Fit H2O mid-range power connector

TSMC achieves 28 nm SRAM yield breakthrough

View articletitled, TSMC achieves 28 nm SRAM yield breakthrough
Add to Citation Manager for TSMC achieves 28 nm SRAM yield breakthrough

Shielding cans with selective non-conductive coating

View articletitled, Shielding cans with selective non-conductive coating
Add to Citation Manager for Shielding cans with selective non-conductive coating

Galaxy Thin Wafer System from DEK enhances process capability for HVM Thinned wafer applications

View articletitled, Galaxy Thin Wafer System from DEK enhances process capability for HVM Thinned wafer applications
Add to Citation Manager for Galaxy Thin Wafer System from DEK enhances process capability for HVM Thinned wafer applications

Gatan launches MonoCL4

View articletitled, Gatan launches MonoCL4
Add to Citation Manager for Gatan launches MonoCL4

Fairchild Semiconductor launches new generation of Super-Junction MOSFETs-SupreMOS™

View articletitled, Fairchild Semiconductor launches new generation of Super-Junction MOSFETs-SupreMOS™
Add to Citation Manager for Fairchild Semiconductor launches new generation of Super-Junction MOSFETs-SupreMOS™

Unique sensor film minimizes defects and improves quality in wafer bonding

View articletitled, Unique sensor film minimizes defects and improves quality in wafer bonding
Add to Citation Manager for Unique sensor film minimizes defects and improves quality in wafer bonding

Fairchild Semiconductor's new programmable LED blinker device addresses the design challenge of driving a single-LED

View articletitled, Fairchild Semiconductor's new programmable LED blinker device addresses the design challenge of driving a single-LED
Add to Citation Manager for Fairchild Semiconductor's new programmable LED blinker device addresses the design challenge of driving a single-LED

Rutronik presents new power relays G9EC and G9EB from Omron

View articletitled, Rutronik presents new power relays G9EC and G9EB from Omron
Add to Citation Manager for Rutronik presents new power relays G9EC and G9EB from Omron

Note from the publisher

Measuring the impact of research

View articletitled, Measuring the impact of research
Add to Citation Manager for Measuring the impact of research