Issues

Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

Dongbo Li; Jianpei Wang; Bing Yang; Yongle Hu; Ping Yang
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Novel implementation of 3D multiplexers in nano magnetic logic technology

Farnoosh Farzaneh; Reza Faghih Mirzaee; Keivan Navi
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The interfacial reliability of through-glass vias for 2.5D integrated circuits

Omar Ahmed; Golareh Jalilvand; Scott Pollard; Chukwudi Okoro; Tengfei Jiang
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Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells

Muhamad Ramdzan Buyong; Farhad Larki; Celine Elie Caille; Norazreen Abd Aziz; Ahamad Ghadafi Ismail; Azrul Azlan Hamzah; Burhanuddin Yeop Majlis
View articletitled, Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells
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Investigations of temperature sensor embedded into PCB

Kamil Janeczek; Aneta Araźna; Wojciech Stęplewski; Marek Kościelski; Krzysztof Lipiec; Ireneusz Rafalik; Sebastian Karolewski; Dorota Liszewska; Anna Sitek
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A 1-mm2 CMOS-pipelined ADC with integrated folded cascode operational amplifier

Norhamizah Idros; Zulfiqar Ali Abdul Aziz; Jagadheswaran Rajendran
View articletitled, A 1-mm<sup>2</sup> CMOS-pipelined ADC with integrated folded cascode operational amplifier
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Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application

Muhamad Ramdzan Buyong; Farhad Larki; Muhamad Ikhmal Hakimi Zainal; Abdelaziz Yousif Ahmed Almahi; Ahmad Ghadafi Ismail; Azrul Azlan Hamzah; Aminuddin Ahmad Kayani Kayani; Céline Elie Caille; Burhanuddin Yeop Majlis
View articletitled, Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application
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