Issues

Special Issue: Heterogeneous Integration and chiplets Interconnection. Guest Editors: Shuye Zhang, Chong Leong Gan, Peng He, Kyung-Wook Paik

Guest editorial: Heterogeneous integration and chiplets interconnection

Shuye Zhang; Chong Leong Gan; Peng He; Kyung-Wook Paik
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Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Tian Huang; Guisheng Gan; Cong Liu; Peng Ma; Yongchong Ma; Zheng Tang; Dayong Cheng; Xin Liu; Kun Tian
View articletitled, Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees
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Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication

Haibo Yang; Fengwei Dai; Liqiang Cao; Guofu Cao; Zhidan Fang; Qidong Wang
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Radiation-hardened flip-flop for single event upset tolerance

Chunhua Qi; Guoliang Ma; Yanqing Zhang; Tianqi Wang; Erming Rui; Qiang Jiao; Chaoming Liu; Mingxue Huo; Guofu Zhai
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Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications

Yuchen Xiao; Huiyi Tang; Hehe Zhang; Xiaoling Yang; Ling Sun; Yong Xie; Baoan Wu; Baifeng Luan; Weidong Xie; Xinnan Cai
View articletitled, Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications
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W-band antenna in package module with hybrid glass-compound WLFO process

Gang Wang; Chenhui Xia; Bo Wang; Xinran Zhao; Yang Li; Ning Yang
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Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging

Youxin Zhang; Yang Liu; Rongxing Cao; Xianghua Zeng; Yuxiong Xue
View articletitled, Effects of <sup>60</sup>Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging
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Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration

Ge Li; Qiushi Kang; Fanfan Niu; Chenxi Wang
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Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles

Liyun Li; Yu Zhang; Shiyu Xia; Zhefei Sun; Junjie Yuan; Dongchuan Su; Hunjun Cao; Xiaoming Chai; Qingtian Wang; Jintang Li; Zhihao Zhang
View articletitled, Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles
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Effects of interface cracks on reliability of surface mount technology interconnection in service environment

Shaoyi Liu; Songjie Yao; Song Xue; Benben Wang; Hui Jin; Chenghui Pan; Yinwei Zhang; Yijiang Zhou; Rui Zeng; Lihao Ping; Zhixian Min; Daxing Zhang; Congsi Wang
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A failure location technology for SiP devices based on TDR nondestructive testing method

Hui Xiao; Xiaotong Guo; Fangzhou Chen; Weiwei Zhang; Hao Liu; Zejian Chen; Jiahao Liu
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The advanced leadless leadframe package and its characteristics

ByongJin Kim; HyeongIl Jeon; GiJeong Kim; WonBae Bang; JinYoung Khim
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The preparation of anisotropic conductive paste and its application in FOB interconnection

Xionghui Cai; Aixia Zhai; Chenglong Zhou; Kyung-Wook Paik
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