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Journal Articles

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Aziz, Chu Yee Khor, Mohd Sharizal Abdul Aziz

Microelectronics International (2021) 38 (4): 182–205.

https://doi.org/10.1108/MI-06-2021-0049

Published: 04 October 2021

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Journal Articles

Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings

Wei Chiat Leong, Mohd Zulkifly Abdullah, Chu Yee Khor, Dadan Ramdan

Microelectronics International (2013) 30 (3): 138–150.

https://doi.org/10.1108/MI-10-2012-0071

Published: 26 July 2013

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