...Lezhi Ye; Xuanjie Song; Chang Yue Purpose Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement stroke, position calibration error and low production efficiency in optical...

... and stage 2. (b) Stage 3 Figure 4 S-parameter characteristics during the evolution. (a) Stage 4. (b) Stage 5 Miniaturization Bandpass filter Multi-mode filters Reconfigurable filters Micro-circuit technology Advanced packaging To further substantiate the operating procedure...

... during reflow soldering. Five design of parameter of flip chip IC package model was proposed for the investigation of copper pillar bump structure on flip chip packaging during reflow soldering. Advanced packaging Computational fluid dynamics Copper pillar bump Solder joint The solidification...

... + R t h , s u b ) .   P e l Semiconductor technology Microelectronics packaging Advanced packaging Light-emitting diodes Thermal resistance Luminous flux Electrical power InGaAlP Indium Gallium Aluminum Phosphide (InGaAlP)-based light-emitting diodes (LEDs...

... size is required to be constantly scaled down in advanced packages. This arises a fact that the reliability of small-size joints is more sensitive to the IMCs because of their high volume proportion and greatly complicated microstructure evolutions. This paper evaluated precise correlations between...

... 27 11 2018 © Emerald Publishing Limited 2019 Emerald Publishing Limited Licensed re-use rights only Finite element method Advanced packaging Microelectronics packaging Fan-out wafer level package Package strength Three-point bending test The fan-out wafer level...

...-resolution dielectric tends to uneven surface. Such a surface results in problems at multilayer circuits. That means you have to find a compromise between via resolution and even surface. There are some technological possibilities to influence this fact: Advanced packaging Thick-film Reliability...

.../°C. Figure 4 K-Factor measurement of InGaAlP thin-film LED 27 05 2017 13 08 2017 08 10 2017 © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use rights only Microelectronics packaging Advanced packaging Materials, functional...

... of high-power LEDs. There were no studies on thermal analysis of low-power SMD LED so far. This work will help in predicting the thermal performance of low-power LEDs in solid-state lighting applications. Semiconductor technology Microelectronics packaging Advanced packaging Thermal management...

... 03 08 2015 01 09 2015 22 09 2015 © Emerald Group Publishing Limited 2016 Emerald Group Publishing Limited Licensed re-use rights only Microelectronics packaging Advanced packaging Recently, examination of IC quality has become more and more important and critical...

.... Andrzej Kos can be contacted at: kos@agh.edu.pl © Emerald Group Publishing Limited 2016 Microelectronics packaging Advanced packaging Chip on board (COB) Ceramics Blind people Thermal screen Blind people can receive information in different ways (Vidal-Verdú and Hafez, 2007). One...

... Limited 2016 Soldering Advanced packaging Chip-on-board (COB) Packaging Chip-on-flexible (COF) Light-emitting diode (LED) Light-emitting diode (LED) has been widely used in various applications because of its low power consumption, long lifetime and short response time (Chang et...

... were made using Cu foil electroplated by Ag layer. Silver sintering technology was used for the ribbon connections assembly to the DBC substrate. Microelectronics packaging Advanced packaging Ag sintering SiC power devices Ceramic package Plastic packages are frequently used...

...) Advanced packaging LTCC 3D structure Chemical reactor Small, compact fuel cells that operate on liquid fuels offer lightweight alternatives to batteries, thus allowing for the greater portability of electronic devices, e.g. laptop computers. These fuel cells are mainly based on low-temperature...

... increases. Jae B. Kwak can be contacted at: jae.kwak@samsung.com © Emerald Group Publishing Limited 2015 Micro-electro-mechanical systems (MEMS) Microelectronics packaging Advanced packaging Chip on board (COB) There have been major researches dealing with thermo-hygro...