...Dhafer Abdul‐Ameer Shnawah; Mohd Faizul Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che Purpose The purpose of this paper is to investigate the effect of Al addition on the bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu (SAC105) solder alloy. Design...

... of the characteristics of low Ag‐content SAC solder joints using minor alloying elements to withstand both thermal cycle and drop impact loads. Design/methodology/approach The thermal cycling and drop impact reliability of different Ag‐content SAC bulk solder will be discussed from the viewpoints of mechanical...

... purpose of this work was to investigate the effects of Al(x) composition to the structural and microstructural properties of Al_xGa_1−xN ternary alloy such as the crystalline quality, crystalline structure and lattice constant c. Design...

.... Findings HRXRD‐RC measurements confirmed that the Al_x In_y Ga_1−x−y N alloys had wurtzite structure. SEM images, element composition analysis by EDX, provided the evidence to show the existence of defects inside the samples contaminated...

... in water solution using Ni^{2 +} and H₂PO₂⁻ ions. The paper presents the results of the studies concerning the influence of bath acidity and conditions of thermal stabilization on the structure and temperature coefficient of resistance of Ni‐P alloy. Findings...

... © MCB UP Limited 2001 --> Alloys Osprey Osprey controlled expansion alloys (Osprey CE alloys) – new Web site Keywords: Alloys, Osprey Osprey has recently re-designed its Web site for its patented range of controlled expansion (7-17ppm/C), high thermal conductivity...

... well known. In this paper a bumping process based on tin/lead alloy plating is reported. The plating bath presented enables the deposition of both solder compositions used for flip‐chip attachment, the eutectic and the lead‐rich. All key issues of the plating process covering plating equipment...