...Tan Chee Wei; Abdul Razak Daud A Cu‐Al bonding system exists when copper wire is bonded onto an aluminum bond pad using thermosonic wire bonding technology. Aged Cu‐Al bonding system was analyzed by measuring the intermetallics layer thickness and its correlation to electrical contact resistance...

...   atalogue . Aluminium Multichip model Multilayers Packaging Several recent research papers deal with the design possibilities of metal substrate carriers suitable, due to their mechanical strength, as packaging base or as MCM chip carriers[ 1 , 2 , 3 ] (Figure 1). When we use...

... layer proves to be of key importance for the insulation properties. Table I gives the main parameters that characterize the different layers. Aluminium Interconnection Multichip module Vacuum deposition Vias The number of the Al conducting layers above ε_o is limited...

..., packaging materials must possess excellent thermal, electrical and mechanical properties. Aluminium nitride, with a thermal conductivity of 170 W/m.K., high fracture strength and a thermal coefficient of expansion match with silicon, has been used to manufacture multilayer LGA (land grid array)packages...