Keywords: Amkor
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Journal Articles
Microelectronics International (2001) 18 (2)
Published: 01 August 2001
... © MCB UP Limited 2001 --> Amkor Environmental impact BGA Amkor Technology nears qualification of environmentally friendly material alternatives for ball grid array packages Keywords Amkor, Environmental impact, BGA In response to worldwide environmental concerns...
Journal Articles
Microelectronics International (2001) 18 (2)
Published: 01 August 2001
... © MCB UP Limited 2001 --> Amkor Taiwan Acquisition Amkor Technology enters Taiwan semiconductor market, acquiring two established assembly and test companies Keywords Amkor, Taiwan, Acquisition Amkor Technology is continuing the momentum of its announced growth...
Journal Articles
Microelectronics International (2001) 18 (2)
Published: 01 August 2001
... © MCB UP Limited 2001 --> Amkor IC packages Amkor Technology stacks die 3-high in IC packages; saves money for system designers and manufacturers Keywords Amkor, IC packages Amkor Technology is expanding its development and qualification of 3D(stacked) IC...
Journal Articles
Microelectronics International (2001) 18 (1)
Published: 01 April 2001
... To further speed the time to production, all package data, including production processes, reliability reports, drawings, equipment process programs and other manufacturing information, can be transmitted electronically from the lab in Arizona to Amkor production facilities in Korea...
Journal Articles
Journal Articles
Microelectronics International (2001) 18 (1)
Published: 01 April 2001
... electronic devices. Amkor also has delivered more than 1 million System in Package (SIP) units in LGA configuration to these same customers over the past year. Further details: http://www.amkor.com © MCB UP Limited 2001 --> Amkor Land grid array Amkor is expanding LGA package...

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