Amkor is expanding LGA package offerings

Amkor is expanding LGA package offerings

Keywords: Amkor, Land grid array

A new family of thinner, lighter, lower cost, more reliable and lead-free packages called land grid array is opening new business opportunities for Amkor Technology as original equipment manufacturers (OEMs) search for new packaging options for portable devices.

Amkor announced that it is expanding efforts to make its land grid array(LGA) option available across a wide range of its product lines. LGA packages are now available using leadframe, laminate and tape substrates, giving a greater range of options for end-use products. LGA packages are connected to device boards through thin, flat lands that provide greater contact strength in portable products that are often subject to abuse in handling. The company has optimized the LGA form factor through board-level testing in-house and with major OEM customers.

Since the company expanded production of LGA packages three years ago, it has delivered more than 60 million units, primarily in MicroLeadFrame(TM) (MLF) and ChipArray® packages, to customers producing cellular telephones, digital cameras, personal computer components and other portable electronic devices. Amkor also has delivered more than 1 million System in Package (SIP) units in LGA configuration to these same customers over the past year.

Further details: http://www.amkor.com