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Keywords: BGA package
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2021) 38 (4): 182–205.
Published: 04 October 2021
...Chong Hooi Lim; Mohd Zulkifly Abdullah; Ishak Abdul Aziz; Chu Yee Khor; Mohd Sharizal Abdul Aziz Purpose This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 169–175.
Published: 26 July 2013
... to Au ball bond. Figure 1 shows construction of FBGA package used in our long term reliability study. The ball bond types refer to Au and Cu ball bonds. The key materials used include 0.8 mil Cu wire (Cu) and 4N (99.99 percent purity) Au wire, fine pitch ball grid array (BGA) package, 110...
