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Keywords: Ball bond diameter
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (1): 53–60.
Published: 04 January 2016
...Hui Yuen Peng; Mutharasu Devarajan; Teik Toon Lee; David Lacey Purpose – The purpose of this paper is to investigate the reliability of wire bonds with three varying ball bond diameters, which are ball bonded with three different sizes of gold wires in light-emitting diode (LED) package under...
