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Keywords: Bondability
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2019) 36 (2): 62–67.
Published: 15 February 2019
...Muhammad Nubli Zulkifli; Fuaida Harun; Azman Jalar Purpose This paper aims to analyze the effect of surface roughness and hardness of leadframe on the bondability of gold (Au) wedge bond using in situ inspection of laser interferometer and its relationship with the deformation and wire...
