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Keywords: COMSOL Multiphysics simulation
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (1): 53–60.
Published: 04 January 2016
... diameters, that is, 140, 120 and 100 μm, respectively. The reliability of these wire bond samples was then studied by performing isothermal aging at 200°C for the time interval of 30, 100 and 500 hours. To validate hypotheses based on the experimental data, COMSOL Multiphysics simulation was also applied...
