Keywords: Ceramics
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Journal Articles
Microelectronics International (2020) 37 (2): 79–85.
Published: 02 April 2020
...Witold Nawrot; Karol Malecha Purpose The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities. Design/methodology/approach A short introduction into additive techniques...
Journal Articles
Microelectronics International (2018) 35 (3): 126–132.
Published: 02 July 2018
...Karol Malecha; Jan Macioszczyk; Piotr Slobodzian; Jacek Sobkow Purpose This paper aims to focus on the application of low temperature co-fired ceramic (LTCC) technology in the fabrication of a microfluidic module with integrated microwave components. The design, technology and performance...
Journal Articles
Journal Articles
Microelectronics International (2017) 34 (3): 116–120.
Published: 07 August 2017
...Jan Kulawik; Dorota Szwagierczak; Agata Skwarek Purpose The purpose of this study was to develop fabrication procedure of multilayer varistors based on doped ZnO and to investigate their microstructure and electrical properties. Design/methodology/approach Two ceramic compositions based on ZnO...
Journal Articles
Journal Articles
Journal Articles
Microelectronics International (2016) 33 (1): 1–8.
Published: 04 January 2016
... built with 294 Peltier modules. Good thermal contact between the Peltier modules and the heat sink has been made to ensure a constant temperature of the bottom surface of the TEC. It was done by soldering Peltier module to a ceramic plate with screen-printed wires. A special TEC was chosen...
Journal Articles
Journal Articles
Microelectronics International (2015) 32 (3): 126–132.
Published: 03 August 2015
...Dr Agata Skwarek; Karol Malecha; Elżbieta Remiszewska; Dorota G Pijanowska Purpose – The purpose of this paper is to focus on the technology and performance of the miniature microfluidic module for urea determination. The presented module was made using low-temperature co-fired ceramics (LTCC...
Journal Articles
Microelectronics International (2015) 32 (3): 110–114.
Published: 03 August 2015
.../approach – The ceramic components of composites were prepared by the standard solid-state reaction method. The intermetallic compound TbFe2 was prepared with an arc melting system with a contact-less ignition in a high purity argon atmosphere. The metal – ceramic – polymer composites were...
Journal Articles
Journal Articles
Microelectronics International (2014) 31 (3): 163–168.
Published: 04 August 2014
... by impedance spectroscopy. Current–voltage (I–U) dependences were measured to characterize nonlinear behavior of the fabricated varistors. Findings – XRD, SEM and EDS studies revealed dense microstructure of ceramic layers with ZnO grains sized 1-4 μm surrounded by nanometric Bi-rich films, submicrometer...
Journal Articles
Microelectronics International (2014) 31 (3): 137–142.
Published: 04 August 2014
...Dr Agata Skwarek; Dorota Szwagierczak Purpose – This paper aims to present the comparative study on the composition, microstructure and dielectric behavior of a group of new nonferroelectric high-permittivity A2/3CuTa4O12 (A = Y, Nd, Sm, Gd, Dy or Bi) ceramics...
Journal Articles
Microelectronics International (2013) 31 (1): 32–41.
Published: 20 December 2013
... advantages of low temperature co-fired ceramic (LTCC) technology in comparison to printed circuit board (PCB) technology based on the performance analysis of presented inductors in lower RF range. Design/methodology/approach – The presented inductors are meander structures fabricated in LTCC and PCB...
Journal Articles
Microelectronics International (2013) 30 (1): 24–32.
Published: 18 January 2013
...Dominik Jurków; Grzegorz Lis Purpose The purpose of this paper is to present the application of low temperature cofired ceramics (LTCC) technology in the fabrication of a novel electronic device, which consists of an antenna amplifier integrated with temperature stabilizer. The temperature...
Journal Articles
Microelectronics International (2013) 30 (1): 3–9.
Published: 18 January 2013
...Chang Keun Lee; Jung Keun Ahn; Cheul Ro Lee; Daesuk Kim; Byung Joon Baek Purpose The purpose of this paper is to investigate the thermal behaviors of high power LED packages to enhance the thermal performances of low temperature co‐fired ceramic chip on board (LTCC‐COB) package. Thermal analysis...
Journal Articles
Microelectronics International (2012) 29 (3): 145–152.
Published: 27 July 2012
...Eszter Horvath; Gabor Henap; Gabor Harsanyi Purpose In microfluidic channel fabrication in low temperature co‐fired ceramics (LTCC), one of the biggest challenges is the elimination of channel deformation during lamination. The purpose of this paper is to describe the expected deformation...
Journal Articles
Journal Articles
Microelectronics International (2007) 24 (3): 27–33.
Published: 31 July 2007
...Winco K.C. Yung; Jijun Zhu Purpose Low temperature co‐fired ceramics (LTCC) material is introduced as an excellent alternative to silicon, glass, or plastic materials for the fabrication of miniaturised analytical devices, though it is most widely used in the automotive and microwave industries...
Journal Articles
Microelectronics International (2007) 24 (2): 14–18.
Published: 24 April 2007
... and CaTi0.8Co0.2O3 were synthesized by solid‐state reaction. Ceramic thermistor materials were sintered in the temperature range 1,300‐1,400°C. The synthesized powders were used for fabrication of thick film pastes and thermistors fired at 1,100‐1,250°C. Resistance‐temperature characteristics of the ceramic samples...

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