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1-20 of 31
Keywords: Ceramics
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2020) 37 (2): 79–85.
Published: 02 April 2020
...Witold Nawrot; Karol Malecha Purpose The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities. Design/methodology/approach A short introduction into additive techniques...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2018) 35 (3): 126–132.
Published: 02 July 2018
...Karol Malecha; Jan Macioszczyk; Piotr Slobodzian; Jacek Sobkow Purpose This paper aims to focus on the application of low temperature co-fired ceramic (LTCC) technology in the fabrication of a microfluidic module with integrated microwave components. The design, technology and performance...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2018) 35 (1): 33–44.
Published: 02 January 2018
... technology Ceramics The miniaturization of a package size can now be achieved through technological advancements. Effective system-level heat dissipation is vital, especially in relation to the miniaturization of the package size, and therefore, highly sophisticated yet cost-effective thermal...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2017) 34 (3): 116–120.
Published: 07 August 2017
...Jan Kulawik; Dorota Szwagierczak; Agata Skwarek Purpose The purpose of this study was to develop fabrication procedure of multilayer varistors based on doped ZnO and to investigate their microstructure and electrical properties. Design/methodology/approach Two ceramic compositions based on ZnO...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (3): 141–148.
Published: 01 August 2016
...Karol Malecha Purpose This paper aims to present a research on utilization of an irreversible bonding between non-transparent low temperature co-fired ceramics (LTCC) and transparent poly(dimethylsiloxane) (PDMS). The research presented in this paper is focused on the technology and performance...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (3): 118–123.
Published: 01 August 2016
... of multilayer elements using low temperature cofired ceramics (LTCC) technology and their characterization. Design/methodology/approach The study focused on tape casting, lamination and co-sintering procedures and dielectric properties of Bi2/3CuTa4O12 multilayer capacitors...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (1): 1–8.
Published: 04 January 2016
... built with 294 Peltier modules. Good thermal contact between the Peltier modules and the heat sink has been made to ensure a constant temperature of the bottom surface of the TEC. It was done by soldering Peltier module to a ceramic plate with screen-printed wires. A special TEC was chosen...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (1): 9–14.
Published: 04 January 2016
...R.P. Pawar; Vijaya Puri Purpose – This paper aims to study the structural, electrical and microwave properties of (Sr0.6Ca0.4) (CoyMn1−y) O3 (0.2 ≤ y ≤ 1.0) thick-film ceramics. Design/methodology/approach – The thick films...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (3): 126–132.
Published: 03 August 2015
...Dr Agata Skwarek; Karol Malecha; Elżbieta Remiszewska; Dorota G Pijanowska Purpose – The purpose of this paper is to focus on the technology and performance of the miniature microfluidic module for urea determination. The presented module was made using low-temperature co-fired ceramics (LTCC...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (3): 110–114.
Published: 03 August 2015
.../approach – The ceramic components of composites were prepared by the standard solid-state reaction method. The intermetallic compound TbFe2 was prepared with an arc melting system with a contact-less ignition in a high purity argon atmosphere. The metal – ceramic – polymer composites were...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (1): 25–31.
Published: 05 January 2015
... Ceramics Magnetoelectric composites are the physical mixture of piezoelectric and magnetostrictive materials. Such types of composites are used in sensors, waveguides, actuators, modulators, transformer, transducers, etc. (Fawzi et al., 2010). The ferrite–ferroelectric composites...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2014) 31 (3): 163–168.
Published: 04 August 2014
... by impedance spectroscopy. Current–voltage (I–U) dependences were measured to characterize nonlinear behavior of the fabricated varistors. Findings – XRD, SEM and EDS studies revealed dense microstructure of ceramic layers with ZnO grains sized 1-4 μm surrounded by nanometric Bi-rich films, submicrometer...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2014) 31 (3): 137–142.
Published: 04 August 2014
...Dr Agata Skwarek; Dorota Szwagierczak Purpose – This paper aims to present the comparative study on the composition, microstructure and dielectric behavior of a group of new nonferroelectric high-permittivity A2/3CuTa4O12 (A = Y, Nd, Sm, Gd, Dy or Bi) ceramics...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 31 (1): 32–41.
Published: 20 December 2013
... advantages of low temperature co-fired ceramic (LTCC) technology in comparison to printed circuit board (PCB) technology based on the performance analysis of presented inductors in lower RF range. Design/methodology/approach – The presented inductors are meander structures fabricated in LTCC and PCB...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (1): 24–32.
Published: 18 January 2013
...Dominik Jurków; Grzegorz Lis Purpose The purpose of this paper is to present the application of low temperature cofired ceramics (LTCC) technology in the fabrication of a novel electronic device, which consists of an antenna amplifier integrated with temperature stabilizer. The temperature...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (1): 3–9.
Published: 18 January 2013
...Chang Keun Lee; Jung Keun Ahn; Cheul Ro Lee; Daesuk Kim; Byung Joon Baek Purpose The purpose of this paper is to investigate the thermal behaviors of high power LED packages to enhance the thermal performances of low temperature co‐fired ceramic chip on board (LTCC‐COB) package. Thermal analysis...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2012) 29 (3): 145–152.
Published: 27 July 2012
...Eszter Horvath; Gabor Henap; Gabor Harsanyi Purpose In microfluidic channel fabrication in low temperature co‐fired ceramics (LTCC), one of the biggest challenges is the elimination of channel deformation during lamination. The purpose of this paper is to describe the expected deformation...
Journal Articles
Mirjana S. Damnjanović, Ljiljana D. Živanov, Snezana M. Djurić, Andrea M. Marić, Aleksandar B. Menićanin, Goran J. Radosavljević, Nelu V. Blaž
Journal:
Microelectronics International
Microelectronics International (2012) 29 (2): 83–89.
Published: 04 May 2012
... consists of n1 straight conductive segments and secondary coil consists of n2 straight conductive segments. Mirjana S. Damnjanović can be contacted at: mirad@uns.ac.rs © Emerald Group Publishing Limited 2012 Transformers Ceramics Ferrite Chip...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2007) 24 (3): 27–33.
Published: 31 July 2007
...Winco K.C. Yung; Jijun Zhu Purpose Low temperature co‐fired ceramics (LTCC) material is introduced as an excellent alternative to silicon, glass, or plastic materials for the fabrication of miniaturised analytical devices, though it is most widely used in the automotive and microwave industries...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2007) 24 (2): 14–18.
Published: 24 April 2007
... and CaTi0.8Co0.2O3 were synthesized by solid‐state reaction. Ceramic thermistor materials were sintered in the temperature range 1,300‐1,400°C. The synthesized powders were used for fabrication of thick film pastes and thermistors fired at 1,100‐1,250°C. Resistance‐temperature characteristics of the ceramic samples...
