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1-6 of 6
Keywords: Curing
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (2): 45–51.
Published: 05 May 2015
... be used to trim downwards and also upwards in the case of polymer thick-film resistors. This type of trimming is called universal trimming, developed first time for polymer thick-film resistors. © Emerald Group Publishing Limited 2015 Thick-/thin-film technology Curing High-voltage...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2003) 20 (3): 11–22.
Published: 01 December 2003
... characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (3): 27–41.
Published: 01 December 2000
...Chi Fo Tsang UV curing processes of materials have to be specially designed accordingly in order to obtain the optimized property for different electronics applications. The purpose of this study is to characterize and study the curing and thermal behavior of a two‐component epoxy‐based UV curable...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> Nordson UV Curing UV companies combine and launch latest in microwave curing Keywords: Nordson UV, Curing Nordson UV Ltd was launched at the end of September 1999 combining the forces of two leading ultra violet curing companies. The new...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2000) 17 (1): 22–27.
Published: 01 April 2000
...D.T. Hsu; H.K. Kim; F.G. Shi; H.Y. Tong; S. Chungpaiboonpatana; C. Davidson; J.M. Adams The curing reaction of a promising “no flow” flip chip underfill encapsulant is investigated by using a differential scanning calorimeter. It is found that the tested underfill can reach complete cure within 20...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (2)
Published: 01 August 1999
... © MCB UP Limited 1999 --> ACT Spectral Curing UV New microwave UV curing system Keywords ACT Spectral, Curing, UV ACT Spectral is launching a new range of microwave-powered UV curing systems for many electronics applications. The first model in the UV-MAC...
