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Keywords: Electronic cooling
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2021) 38 (4): 182–205.
Published: 04 October 2021
... electronic cooling. Optimal Re could be used as a reference in the thermal management aspect in designing the BGA package. Originality/value This research presents the parameters’ effects on the reliability and heat transfer in FPCB design. It also presents a method to optimize Re...
