... and a lower substrate temperature. Jian‐Wei Hoon can be contacted at: jwhoon85@gmail.com © Emerald Group Publishing Limited 2011 Thin films Electronic engineering Substrates Temperature In the present work, we investigated the effects of deposition pressure and substrate temperature...

... management Electronic engineering Packaging Manufacturing systems Supply chain management In general, companies focus largely on ensuring packages pass required functional tests, meet design specifications and go into production with high yields in large volumes. Desired design life can...

..., microhardness and improve ductility. Originality/value The processing employed in this paper would enable realization of electronic packages made out of Al‐Si/SiC_p MMCs. Montasser S. Tahat can be contacted at: tahat22@yahoo.com © Emerald Group Publishing Limited 2010 Electronic...

... and the power consumption for this device is 253.20 mW. Originality/value This paper shows the merits of the parasitic‐aware design methods used in designing the core circuit. Amiza Rasmi can be contacted at: amiza@tmrnd.com.my © Emerald Group Publishing Limited 2010 Electronic engineering...

... be contacted at: chris_li@wistron.com; lee.a37385@msa.hinet.net © Emerald Group Publishing Limited 2009 Chemical properties of materials Contamination Electronic engineering Assembling Quality control In microelectronics assembly, organic materials (and its compounds) are usually employed...

... Publishing Limited 2009 Wires Bonding Copper Electronic engineering Today's microelectronics devices have many modern packages such as ball‐grid‐array (BGA) packages and chip‐scale packages (Xie et al., 2002 ; Tee et al., 2003b ; Plieninger et al., 2006...

... applications with the potential to meet the microelectronics industry's future demands on thermal performance and cost efficiency is presented. © Emerald Group Publishing Limited 2009 Electronic engineering Films (states of matter) Thermal resistance Thermal conductivity Composite materials...

... designer to predict the temperature and heat flux of critical components with the accuracy required for reliability and performance prediction. F. Mohammadi can be contacted at: fmohamma@ee.ryerson.ca © Emerald Group Publishing Limited 2008 Electronic engineering Thermal measurement...

... Publishing Limited 2008 Electronic engineering Comparator circuits Ignition voltage Electric current A comparator is used to detect whether one signal is greater or smaller than another. They are used in large abundance in A/D converters (ADC) and also find many applications, such as data...

...)). The contacting parts are made of polyether ether ketone, a hygienically safe material for such applications. © Emerald Group Publishing Limited 2008 Elastomers Epoxy resins Electronic engineering Transistors A comparison of different ISFET packaging methods elaborated in this paper...

... insulated wire are discussed. Z.W. Zhong can be contacted at: mzwzhong@ntu.edu.sg © Emerald Group Publishing Limited 2008 Electrical insulation Electronic engineering Bonding Wires Integrated circuit (IC) technologies are resulting in the required advances through size...

.... Especially, large changes occurred for buried components. Influence of frequency on those characteristics was also larger for Du Pont composition. © Emerald Group Publishing Limited 2008 Films (states of matter) Capacitors Electronic engineering Thick‐film capacitors are widely used...

... optimization methods, the optimal wire shape is obtained. © Emerald Group Publishing Limited 2008 Optimization techniques Bonding Wires Finite element analysis Electronic engineering Using the developed FEM models, we have examined the occurrence of wire failures due to the following...

... Publishing Limited 2006 Electronic engineering Radiofrequencies Design Transceivers Phase‐locked loop (PLL) is widely used in the electronic industries nowadays, especially for applications such as frequency synthesis in RF transceivers, noise and jitter suppression in communications...

... © Emerald Group Publishing Limited 2005 --> Electronic engineering Financing Research and development Hewitt offers £80 million investment in world-beating technologies Keywords: Electronic engineering, Financing, Research and development National competition...

... © Emerald Group Publishing Limited 2005 --> Electronic engineering Distribution NuSil Technology appoints new distributors in Europe and Middle East Keywords: Electronic engineering, Distribution NuSil Technology has expanded its roster of distribution resources...

...John Ling © Emerald Group Publishing Limited 2005 --> Conferences Electronic engineering Keywords: Conferences, Electronic engineering Microtech 2005 Møller Conference Centre, Cambridge, 1-2 March 2005 The Møeller Centre in Cambridge proved popular in 2004...

... © Emerald Group Publishing Limited 2005 --> Electronic engineering Mergers and acquisitions Amplifiers Agilent Technologies to acquire Wavics, leading provider of innovative power amplifiers for mobile handset market Keywords: Electronic engineering, Mergers...

... © Emerald Group Publishing Limited 2005 --> Electronic engineering Assembly Quality awards CorinTech awarded BSI kitemark IPC-A- 610C licence Keywords: Electronic engineering, Assembly, Quality awards Following rigorous assessment of its electronic assembly...

...Brian Ellis Keith   Brindley . Starting Electronics . Newnes , , ISBN: 0 7506 6386 3   GBP 9.99, USD 19.95, EUR 16.95 3rd edition Paperback, 216 × 138 × 16 mm, 282+vi pp, 11 ch. © Emerald Group Publishing Limited 2005 --> Electronic engineering Books Let me...