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Keywords: Flux cleaning
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Journal Articles
Yap Boon Kar, Noor Azrina Talik, Zaliman Sauli, Foong Chee Seng, Tan Chou Yong, Vithyacharan Retnasamy
Journal:
Microelectronics International
Microelectronics International (2013) 30 (2): 99–103.
Published: 26 April 2013
..., formed during the die attachment process, could affect the package long‐term performance. Design/methodology/approach Thus, the flux‐cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water‐based solvent were carried out to investigate the flux...
