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Keywords: Joining process
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2007) 24 (3): 18–26.
Published: 31 July 2007
... ; Schoenfelder et al., 2007), microelectronics packaging, and detection/analysis of various defects (Paehler et al., 2007) also face more and more new challenges. Wires Joining process Soldering Thermomechanical fatigue (TMF) is a major cause of failure in electronic devices. Solder...
