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Keywords: Metallizing
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2010) 27 (1): 11–16.
Published: 26 January 2010
... in thermosonic gold wire bonding on aluminium metallization pads and the effect of bonding time on the initiation of bonding. Design/methodology/approach A gold wire (20 μm diameter/99.99 per cent wt%) was bonded to aluminium metallization pads (1 μm thick) on a silicon chip using a commercial ball/wedge...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2009) 26 (2): 24–27.
Published: 08 May 2009
.../value In this paper, it was at first explained how the changes of the structure of Ni‐P resistive layers depend on their temperature coefficient of capacitance. J. Kulawik can be contacted at: jkulawik@ite.waw.pl © Emerald Group Publishing Limited 2009 Alloys Metallizing Electrical...
