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Keywords: Nordic
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> IMAPS Nordic E. Jan Vardaman, TechSearch International, USA "A market and technology analysis of high density substrates for IC packages". Moses Chan CS2, Belgium "Effects of package construction on thermal performance of BT based ball grid...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (2)
Published: 01 August 1999
... © MCB UP Limited 1999 --> IMAPS Nordic IMAPS Nordic Keywords IMAPS, Nordic Call for Abstracts The IMAPS Nordic 36th Annual Conference Fiskartorpet/Kalastajatorppa, Helsinki, Finland 19-22 September 1999 Speakers were invited to submit a free format...
